Among the various sputtering coating technologies, magnetron sputtering technology is one of the most important technologies. In order to prepare a thin film with a large area and a uniform batch, the target base distance is optimized, the substrate movement mode is changed, and the film thickness is implemented. Multi-station magnetron sputtering coating equipment is more and more valued and used because of its adjustable speed ratio and production of multiple substrates at the same time.

In the actual coating, sometimes the target material is not suitable for opening in the middle, and for the Shizi controlled spattering system, so the method of improving the thickness uniformity of the film by changing the target shape in actual production is not feasible. Therefore, it is necessary and significant to find a feasible method that can improve the uniformity of film thickness.

A multifunctional magnetron sputtering coating system is provided. This system is integrated with a vacuum coating system and a glove box system. It can complete thin film evaporation in a high vacuum evaporation chamber and under a high purity inert gas atmosphere in the glove box. The combination of evaporation coating and glove box realizes the fully enclosed production of evaporation, packaging, and testing processes, so that the entire film growth and device preparation process is highly integrated in a complete controllable environment atmosphere system, eliminating the organic large area circuit preparation The influence of unstable factors in the atmospheric environment guarantees the preparation of high-performance, large-area organic optoelectronic devices and circuits.

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