Parallel Seam Sealers

This is a high-throughput, high-efficiency packaging solution designed for high-hermeticity, high-reliability electronic devices and sensitive material-based components. It upgrades the sealing process from a conventional nitrogen-filled workbox to a fully enclosed, recirculating purification environment, capable of maintaining a stable low H₂O/O₂ atmosphere (e.g., <100 ppm). This significantly improves the purity and consistency of the internal gas environment after sealing, while also protecting operators from potential metal spatter or laser-related hazards (compared with laser welding).

The integrated oven is used to bake and degas device internals and/or housings/lids prior to sealing. Through antechambers, operators can load parts into the system and remove finished products without disturbing the main chamber atmosphere, greatly improving production efficiency.

This system is suitable for any sealed electronic devices that require absolute moisture protection, corrosion resistance, and long-term stability.